Thank you for registering.

One of our academic counsellors will contact you within 1 working day.

Please check your email for login details.
MY CART (5)

Use Coupon: CART20 and get 20% off on all online Study Material

ITEM
DETAILS
MRP
DISCOUNT
FINAL PRICE
Total Price: Rs.

There are no items in this cart.
Continue Shopping

what is 3d bonding? what topics does it contain?

what is 3d bonding?
what topics does it contain?

Grade:

1 Answers

SAGAR SINGH - IIT DELHI
879 Points
10 years ago

Dear student,

SUSS MicroTec and Thin Materials, are developing a temporary solution for use in thin wafer handling technologies to ease 3D integration and packaging.

The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250°C while being able to do a room temperature de-bond. This simplifies the debond process by eliminating a number of steps, thus saving time and lowering device costs. The Thin Materials process runs on SUSS MicroTec's production wafer bonder, XBC300, whose modularity and high process flexibility can easily be adapted for changing environments and processed material. The XBC300 temporary bond configurations are available for development and high volume needs.

Think You Can Provide A Better Answer ?

Provide a better Answer & Earn Cool Goodies See our forum point policy

ASK QUESTION

Get your questions answered by the expert for free