what is 3d bonding? what topics does it contain?

Dear student,

SUSS MicroTec and Thin Materials, are developing a temporary solution for use in thin wafer handling technologies to ease 3D integration and packaging.

The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250°C while being able to do a room temperature de-bond. This simplifies the debond process by eliminating a number of steps, thus saving time and lowering device costs. The Thin Materials process runs on SUSS MicroTec's production wafer bonder, XBC300, whose modularity and high process flexibility can easily be adapted for changing environments and processed material. The XBC300 temporary bond configurations are available for development and high volume needs.